LTI
Filed: April 18, 1977
CIRCUIT BOARD LAMINATES
Owned by: LAMINATION TECHNOLOGY INC.
Serial Number: 73123233
HI-TEK
Filed: March 20, 1978
Copper Clad Laminates Comprising an Insulative Substrate, Epoxy Resin and Outer Layers of Copper Foil
Owned by: LAMINATION TECHNOLOGY INC.
Serial Number: 73162765
TEK-PAK
Filed: March 20, 1978
MASS MOLDED MULTILAYER LAMINATES
Owned by: LAMINATION TECHNOLOGY INC.
Serial Number: 73162822
TEK-PLY
Filed: March 20, 1978
Resin Impregnated Glass Cloth Used for Printed Wiring or Multilayer Printed Wiring Boards which Are Used for Electronic…
Owned by: LAMINATION TECHNOLOGY INC.
Serial Number: 73162860
LAMINATION TECHNOLOGY
Filed: July 13, 1981
CIRCUIT BOARD LAMINATES; MASS LAMINATIONMULTI-LAYER PANELS; PRE- PREG MATERIALS SUCH AS GLASS CLOTH IMPREGNATED WITH EXPOXY…
Owned by: LAMINATION TECHNOLOGY INC.
Serial Number: 73318625
LTI
Filed: July 1, 1985
CUSTOM DESIGN OF ELECTRONIC CIRCUIT BOARD LAMINATES TO THE ORDER OF OTHERS
Owned by: LAMINATION TECHNOLOGY INC.
Serial Number: 73545629