Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; Optical metrology, characterization, and inspection systems comprised of a machine, components and operating software therefor sold as a unit for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components

Optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; Metrology inspection equipment for use in the manufacturing, inspection, testing and repair of semiconductor substrates; Metrology inspection equipment and devices, namely, instruments and devices that sense and capture images of semiconductor components, semiconductor wafers, semiconductor die, packaged integrated circuits, printed circuit boards, liquid crystal displays, electronic displays, and disk storage media, and inspect these images for defects, coordinate or position determination, identification, or presence or absence of a feature, characteristic or substance thereon; Metrology inspection systems comprised of one or more light sources, one or more cameras and/or sensors in communication with computer software and hardware used for the measurement of thickness, adhesion properties, and structural properties of semiconductor materials and for monitoring the performance of semiconductor fabrication processes; Optical inspection equipment for 2D and 3D inspection of semiconductor materials; Metrology instruments metrology purposes, namely, apparatus for measuring physical dimensions of samples and thicknesses of deposited films or for analyzing chemical composition of materials, consisting of optical microscope, electron microscope, spectrophotometer, ellipsometer and scanning slit densitometer technology

Providing temporary use on online, non-downloadable process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogenous packaging, and other advanced packaging electronics technologies; Software for the semiconductor industry, namely, software for identifying defects in semiconductor structures, software for identifying semiconductor fabrication process excursions, software for recording and reviewing defects in semiconductors structures, software for identifying root causes of defects in semiconductor structures, and software for controlling and monitoring semiconductor fabrication equipment