Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; Optical metrology, characterization, and inspection systems comprised of a machine, components and operating software therefor sold as a unit for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies; optical metrology, characterization, and inspection systems comprised of machine, components and operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components

Optical metrology, characterization, and inspection systems comprised of preinstalled operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogeneous packaging, and other advanced packaging electronics technologies

Providing temporary use on online, nondownloadable process control and defect analysis software for use in the production of laminar substrates including discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, system in package, heterogenous packaging, and other advanced packaging electronics technologies