HYESHINE - Trademark Details
Status: 630 - New Application - Record Initialized Not Assigned To Examiner
Serial Number
99907167
Word Mark
HYESHINE
Status
630 - New Application - Record Initialized Not Assigned To Examiner
Status Date
2026-06-26
Filing Date
2026-06-26
Mark Drawing
3 - Illustration: Drawing or design which also includes word(s)/ letter(s)/number(s)
Design Searches
261702, 261709 - Wavy line(s), band(s) or bar(s). Curved line(s), band(s) or bar(s).
Attorney Name
Statements
Indication of Colors claimed
Color is not claimed as a feature of the mark.
Description of Mark
The mark consists of a stylized double-layer curved ribbon design positioned above the stylized wording "HYESHINE".
Goods and Services
Abrasive disks for power-operated grinders; Power-operated abrasive wheels; Abrasive disks for power-operated sanders; Abrasive belts for power-operated sanders; Abrasive wheels for power-operated grinders; Flap discs for power-operated grinders; Grinding tools for grinding machines; Grinders being power tools; Power-operated polishers; Polishing system for use in single-head machines comprising grinding and polishing discs for stone profiling and edges; Polishing discs for automated wet-polishing multi-head machines
Pseudo Mark
HYE SHINE
Classification Information
International Class
007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements (other than hand-operated); incubators for eggs. - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements (other than hand-operated); incubators for eggs.
US Class Codes
013, 019, 021, 023, 024, 031, 034, 035
Class Status Code
6 - Active
Class Status Date
2026-06-26
Primary Code
007
Current Trademark Owners
Party Name
Party Type
10 - Original Applicant
Legal Entity Type
99
Address
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Correspondences
Name
Yiqi Wang
Address
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Trademark Events
| Event Date | Event Description |
| 2026-06-26 | NEW APPLICATION ENTERED |
| 2026-06-26 | APPLICATION FILING RECEIPT MAILED |
