TSINGHOO - Trademark Details
Status: 630 - New Application - Record Initialized Not Assigned To Examiner
Serial Number
99739809
Word Mark
TSINGHOO
Status
630 - New Application - Record Initialized Not Assigned To Examiner
Status Date
2026-04-01
Filing Date
2026-04-01
Mark Drawing
4 - Standard character mark
Attorney Name
Statements
Goods and Services
Semi-worked thermoplastic filaments used for 3D printing; Semi-worked PLA (polylactic acid) filaments for use in 3D printing; Semi-worked ABS (acrylonitrile butadiene styrene) filaments for use in 3D printing; Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of pellets, rods, foils, foams, fibers, films and sheets; Plastic material in extruded form for use in production; Plastic in powdered form; Acrylic resins, semi-processed; Plastic filaments for 3D printing; Semi-finished synthetic plastics in the form of blocks for use in manufacture; Semi-processed plastics in the form of blocks for use in manufacture
Pseudo Mark
TSINGHUA
Translation of Words in Mark
Tsinghoo has no meaning in a foreign language.
Classification Information
International Class
017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal. - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes
001, 005, 012, 013, 035, 050
Class Status Code
6 - Active
Class Status Date
2026-04-01
Primary Code
017
First Use Anywhere Date
2026-02-23
First Use In Commerce Date
2026-02-23
Current Trademark Owners
Party Type
10 - Original Applicant
Legal Entity Type
99
Address
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Correspondences
Name
Divya Kannegenti
Address
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Trademark Events
| Event Date | Event Description |
| 2026-04-01 | NEW APPLICATION ENTERED |
| 2026-04-01 | APPLICATION FILING RECEIPT MAILED |
