Mechanically compliant and durable pads or films as heat dissipation product for electronics or electronic testing machines, namely, vertically aligned carbon nanotube arrays in a polymer matrix supported by metal foil as heat exchangers being parts of machines or instrument, as a means of improving heat transfer between heat sources in the nature of heaters, electronics, and heat sinks; Mechanically compliant and durable pads or films that are thermally conductive, namely, vertically aligned carbon nanotube arrays in a polymer matrix supported by metal foil used as thermal or electrical interface materials in the nature of tubular carbon molecules used in electronic and mechanical applications, in particular semiconductor chip testing and heat sink and heat source applications for use in electronic components; Mechanically compliant and durable pads or films that are thermally conductive, namely, vertically aligned carbon nanotube arrays in a polymer matrix supported by metal foil used as thermal or electrical interface materials for semiconductor chip testing, adhered between and sold as a component of a heat sink and heat source for use in a heat transfer apparatus