CMC MATERIALS - Trademark Details
Status: 819 - SU - Registration Review Complete
Serial Number
88719666
Word Mark
CMC MATERIALS
Status
819 - SU - Registration Review Complete
Status Date
2022-02-01
Filing Date
2019-12-09
Mark Drawing
3000 - Illustration: Drawing or design which also includes word(s)/ letter(s)/number(s)
Typeset
Design Searches
261702, 261704 - Wavy line(s), band(s) or bar(s). Vertical line(s), band(s) or bar(s).
Published for Opposition Date
2020-05-26
Attorney Name
Law Office Assigned Location Code
L10
Employee Name
CLARK, ROBERT C
Statements
Indication of Colors claimed
Color is not claimed as a feature of the mark.
Disclaimer with Predetermined Text
"MATERIALS"
Description of Mark
The mark consists of horizontal wavy line with a horizontal straight line bisecting the wavy line equally to the left of the words "CMC MATERIALS".
Goods and Services
Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA) and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
Goods and Services
Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
Goods and Services
Industrial lubricants, namely, valve lubricants for the oil and gas storage, pipeline and gas distribution markets; Industrial lubricants and greases
Goods and Services
Herbicide
Goods and Services
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
Goods and Services
Industrial sealants, namely silicone sealants and waterproof sealants; Industrial sealants, namely pipe joint sealant; Pipe joint sealant for the oil and gas storage, pipeline and gas distribution markets
Goods and Services
Leasing of oil and gas drilling equipment
Pseudo Mark
CABOT MICROELECTRONICS CORPORATION MATERIALS
Classification Information
International Class
001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes
001, 005, 006, 010, 026, 046
Class Status Code
6 - Active
Class Status Date
2019-12-12
Primary Code
001
First Use Anywhere Date
2021-05-24
First Use In Commerce Date
2021-05-24
International Class
003 - Bleaching preparations and other substances for laundry use; cleaning, polishing, scouring and abrasive preparations; soaps; perfumery, essential oils, cosmetics, hair lotions; dentifrices. - Bleaching preparations and other substances for laundry use; cleaning, polishing, scouring and abrasive preparations; soaps; perfumery, essential oils, cosmetics, hair lotions; dentifrices.
US Class Codes
001, 004, 006, 050, 051, 052
Class Status Code
6 - Active
Class Status Date
2019-12-12
Primary Code
003
First Use Anywhere Date
2021-05-17
First Use In Commerce Date
2021-05-17
International Class
007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements (other than hand-operated); incubators for eggs. - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements (other than hand-operated); incubators for eggs.
US Class Codes
013, 019, 021, 023, 024, 031, 034, 035
Class Status Code
6 - Active
Class Status Date
2019-12-12
Primary Code
007
First Use Anywhere Date
2021-05-19
First Use In Commerce Date
2021-05-19
Current Trademark Owners
Party Name
Party Type
21 - 1st New Owner After Publication
Legal Entity Type
03 - Corporation
Address
Please log in with your Justia account to see this address.
Trademark Owner History
Party Name
Party Type
21 - 1st New Owner After Publication
Legal Entity Type
03 - Corporation
Address
Please log in with your Justia account to see this address.
Party Name
Party Type
20 - Owner at Publication
Legal Entity Type
03 - Corporation
Address
Please log in with your Justia account to see this address.
Party Name
Party Type
10 - Original Applicant
Legal Entity Type
03 - Corporation
Address
Please log in with your Justia account to see this address.
Correspondences
Name
Elizabeth K. Rucki
Address
Please log in with your Justia account to see this address.
Trademark Events
| Event Date | Event Description |
| 2019-12-12 | NEW APPLICATION ENTERED IN TRAM |
| 2019-12-12 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM |
| 2019-12-13 | NOTICE OF DESIGN SEARCH CODE E-MAILED |
| 2020-02-24 | ASSIGNED TO EXAMINER |
| 2020-02-24 | NON-FINAL ACTION WRITTEN |
| 2020-02-24 | NON-FINAL ACTION E-MAILED |
| 2020-02-24 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| 2020-02-25 | NON-FINAL ACTION WRITTEN |
| 2020-02-25 | NON-FINAL ACTION WRITTEN |
| 2020-02-25 | NON-FINAL ACTION WRITTEN |
| 2020-02-25 | NON-FINAL ACTION E-MAILED |
| 2020-02-25 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| 2020-04-13 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| 2020-04-13 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| 2020-04-13 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| 2020-04-14 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| 2020-04-22 | ASSIGNED TO LIE |
| 2020-05-06 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| 2020-05-26 | PUBLISHED FOR OPPOSITION |
| 2020-05-26 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| 2020-07-21 | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
| 2021-01-13 | TEAS PETITION TO DIRECTOR RECEIVED |
| 2021-01-13 | TEAS EXTENSION RECEIVED |
| 2021-01-13 | EXTENSION 1 FILED |
| 2021-01-13 | EXTENSION 1 GRANTED |
| 2021-01-15 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| 2021-04-13 | ASSIGNED TO PETITION STAFF |
| 2021-04-13 | ASSIGNED TO PETITION STAFF |
| 2021-04-03 | PETITION TO DIRECTOR - GRANTED |
| 2021-05-12 | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP |
| 2021-07-21 | TEAS EXTENSION RECEIVED |
| 2021-07-21 | EXTENSION 2 FILED |
| 2021-07-21 | EXTENSION 2 GRANTED |
| 2021-07-23 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| 2022-01-21 | TEAS STATEMENT OF USE RECEIVED |
| 2022-01-21 | TEAS EXTENSION RECEIVED |
| 2022-01-31 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
| 2022-01-21 | EXTENSION 3 FILED |
| 2022-01-31 | EXTENSION 3 GRANTED |
| 2022-01-21 | USE AMENDMENT FILED |
| 2022-01-31 | STATEMENT OF USE PROCESSING COMPLETE |
| 2022-02-01 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| 2022-02-01 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
| 2022-02-02 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
