Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly

[Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices]