Machines and structural parts therefore, for the production, treatment, transport and processing of electronic components, namely, semiconductors, in the field of microelectronic, medical technology, biotechnology, semiconductor technology and microsystems technology; machines and structural parts therefor, for the production, treatment and processing of semiconductors; machines and structural parts therefore for treatment of surfaces of electronic components, especially wafers

Scientific apparatus and instruments for microelectronics, biotechnology, microsystem techniques, semiconductor and nanotechnology, namely, exposure systems for 1X lithography applications, namely, mask aligners and contact and proximity printers and devices for joining one or multiple substrates temporarily or permanently, namely, substrate bonding systems comprised of UV-radiation/UV-light source devices, heaters, and pneumatic and hydraulic piston setups and spindles; systems for the application of coatings to work pieces, namely, resist coaters, developer systems for developing lithographically structured layers, namely, resist developers, imprinting systems used to imprint pattern onto surfaces on work pieces, namely, imprint lithography systems comprised of one or more of the following components, alignment stages for substrate to stamp alignment suitable for a single step or step and repeat alignment, means to apply imprinting force, means to cure the imprint resist such as a UV- light source and heaters, measurement apparatus that can detect the relative position of the stamp versus the substrate and provide the input for the alignment procedure; lamination equipment used to coat surfaces with tape like materials; surveying instruments; electric, photographic, optical, measuring, signal, and monitoring devices, namely, precision systems in the semiconductor technology, in microelectronics, in medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology, namely, front to backside alignment accuracy measurement systems comprised of one or more of the following: measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; infrared microscopes, metrology systems comprised of one or more of the following, infrared light source devices for infrared inspection of the bonding interface, infrared detectors to detect the infrared light passing through the bond interface, ultrasonic transducers and detectors, x-ray transducers and detectors, visible light light-sources and cameras, microscope setups, computer hardware and operating software for data analysis for the inspection of wafer bonding interfaces; overlay accuracy measurement systems comprised of optical detection devices, namely, microscopes and lasers to detect the positions of two patterns in reference to each other, computer hardware for data analysis and collection, as well as mapping; critical dimension metrology systems comprised of optical detection devices, namely, microscopes and lasers to detect the two or more features of a specific pattern on the wafer and allow for calculation of the distance between them, as well as a computer hardware for data analysis, collection and mapping; pressure uniformity metrology apparatus; apparatus for analysis, namely, front to backside alignment accuracy measurement system comprised of one or more of the following: measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware and software that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; [ semiconductor chips, integrated circuits; ] computer operation programs; [ peripheral equipment for computers; ] data processing units, data processors and computer hardware; computer software related to the analysis of lithography results, software for the analysis of wafer bonding results, aligning software; scientific diagnosis devices in bio-chip format, namely, oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries, combinatorial substance libraries on chip surfaces for scientific purposes; [ remote controls for electric systems for remote controlled industrial operational processes, namely, laboratory robots; ] electric control panels for manufacturing facilities for microelectronics, medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology; [ filters and masks for photographic and photolithographic equipment; telescopes; telephones; semiconductors; ] monitoring devices, namely, oscillographs, indicators, surveying instruments; [ data processing coupler; special furniture for laboratories; ] laser for non-medical purposes; [ reading devices for processing electronic data; ] measuring instruments and measuring devices, namely, laser measuring devices; material testing instruments and machines, namely, machines for testing bonding strength in bonded substrates, front to backside alignment accuracy measurement systems comprised of one or more of the following: measurement apparatus that detect a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware and related software that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; infrared microscopes, metrology systems comprised of one or more of the following; infrared light source devices for infrared inspection of the bonding interface, infrared detectors to detect the infrared light passing through the bond interface, ultrasonic transducers and detectors, x-ray transducers and detectors, visible light light-sources and cameras, microscope setups, computer hardware and related software for data analysis for the inspection of wafer bonding interfaces; optical apparatus and instruments, namely, microscopes; photographic apparatus and instruments, namely, cameras; [ video projectors; controlled volume pumps; protective clothing, in particular for clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; photographic range finders ]

Medical diagnosis devices in bio-chip format, namely, oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries for medical purposes, combinatorial substance libraries on chip surfaces for medical purposes [ ; medical diagnostic devices, namely, micro-titer plates and nano-titer plates; analyzers for medical purposes, namely, machines used to carry out automatic testing of biological samples; bio-array chips for being used as diagnosis means for bio-chemical applications, namely, for tissue and secretory tests, as well as for indication of physiologic parameters or of genetic information, for screening in the pharmaceutical industry for developing drugs, for process monitoring with biotechnological processes; miniaturized sensors for use in gene analysis and diagnosis; medical devices, namely, accessories for bio-chips for filling and manipulating the same by machine as well as manually, namely, chip-holders, chip reader devices, as well as electronic, fluidal, and mechanic control therefor ]

Engineering services; development of precision systems and devices for the semiconductor technology; development of devices for microsystem techniques, microelectronics, medical techniques, biotechnology and telecommunication for others; consulting in the fields of medical and scientific equipment; research services in the field of microsystem technology and nanotechnology; research services in the field of bio-sensorics and chemical sensorics; technical consulting for third parties concerning handling production plants and process equipment; providing temporary use of non-downloadable software for data processing; designing of computer software for others