Handling machines, automatic handling machines, and automated equipment used for processing and production of semiconductor chips and electronic components in the semiconductor industry, namely, tape and reel machines, bare die sorter-to-tray machines and CSP sorter-to-tray machines, wafer-to-wafer sorter machines, automatic encapsulation machines and automatic molding machines, vision integrated machines and lead and mark vision inspection machines, package visual inspection machines, ball and lead inspection machines, lead conditioning machines, integrated mark, scan, and pack machines, laser marking machines, tray laser symbolizers, strip laser symbolizers, singulated laser symbolizers, integrated machines for CMOS sensors, trim and form machines, eprom UV erasing machines, de-taping machines, UV curing machines, strip handling ink marking machines, singulated handling ink marking machines; automatic manipulators used for back-end processing and production of semiconductor chips and electronic components in the semiconductor industry; automated machines and equipment for wirebonding, encapsulation, marking, sawing, trimming, forming, testing and packaging of semiconductor chips and electronic components, namely, tape and reel machines, bare die sorter-to-tray machines and CSP sorter-to-tray machines, wafer-to-wafer sorter machines, automatic encapsulation machines and automatic molding machines, vision integrated machines and lead and mark vision inspection machines, package visual inspection machines, ball and lead inspection machines, lead conditioning machines, integrated mark, scan and pack machines, laser marking machines, tray laser symbolizers, strip laser symbolizers, singulated laser symbolizers, integrated machines for CMOS sensors, trim and form machines, eprom UV erasing machines, de-taping machines, UV curing machines, strip handling ink marking machines, and singulated handling ink marking machines; automated equipment which detect micro visual-mechanical defects on semiconductor chips, namely, vision integrated machines, lead and mark vision inspection machines, package visual inspection machines, and ball and lead inspection machines; automated equipment, namely, test handler machines, which detect functional defects on semiconductor chips; automated equipment which laser or ink mark semiconductor chips to identify ownership and product attributes, namely, laser marking machines, tray laser symbolizers, strip laser symbolizers, singulated laser symbolizers, ink marking machines, strip handling ink marking machines, and singulated handling ink marking machines; automated equipment which condition leads; automated equipment which package semiconductor chips in tape and reel form, namely, tape and reel machines and integrated mark, scan and pack machines; automated equipment, namely, trim and form machines, which saw or trim continuous strips of undivided semiconductor chips into individual semiconductor chips