ACCRETECH - Trademark Details
Status: 606 - Abandoned - No Statement Of Use Filed
Serial Number
76182002
Word Mark
ACCRETECH
Status
606 - Abandoned - No Statement Of Use Filed
Status Date
2006-04-23
Filing Date
2000-12-15
Mark Drawing
1000 - Typeset: Word(s)/letter(s)/number(s)
Typeset
Published for Opposition Date
2003-01-28
Attorney Name
Law Office Assigned Location Code
M40
Employee Name
AMOS, TANYA L
Statements
Goods and Services
Brokerage of manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
Goods and Services
Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
Goods and Services
Rental of manufacturing apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Rental of measuring apparatus, namely-- Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines
Classification Information
International Class
36 - Insurance; financial affairs; monetary affairs; real estate affairs. - Insurance; financial affairs; monetary affairs; real estate affairs.
US Class Codes
100, 101, 102
Class Status Code
6 - Active
Class Status Date
2001-01-02
Primary Code
036
International Class
37 - Building construction; repair; installation services. - Building construction; repair; installation services.
US Class Codes
100, 103, 106
Class Status Code
6 - Active
Class Status Date
2001-01-02
Primary Code
037
International Class
40 - Treatment of materials. - Treatment of materials.
US Class Codes
100, 103, 106
Class Status Code
6 - Active
Class Status Date
2001-01-02
Primary Code
040
Correspondences
Name
CURTIS B HAMRE
Address
Please log in with your Justia account to see this address.
Prior Registrations
Relationship Type | Reel Number |
Continuity Child | 76976714 |
Trademark Events
Event Date | Event Description |
2001-03-29 | ASSIGNED TO EXAMINER |
2001-04-11 | NON-FINAL ACTION MAILED |
2001-10-11 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
2002-02-05 | FINAL REFUSAL MAILED |
2002-07-15 | PAPER RECEIVED |
2002-07-15 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
2002-11-25 | APPROVED FOR PUB - PRINCIPAL REGISTER |
2003-01-08 | NOTICE OF PUBLICATION |
2003-01-28 | PUBLISHED FOR OPPOSITION |
2003-04-22 | NOA MAILED - SOU REQUIRED FROM APPLICANT |
2003-10-14 | PAPER RECEIVED |
2003-10-14 | EXTENSION 1 FILED |
2003-11-10 | EXTENSION 1 GRANTED |
2004-04-23 | PAPER RECEIVED |
2004-04-26 | ASSIGNED TO EXAMINER |
2004-04-23 | DIVISIONAL REQUEST RECEIVED |
2004-05-04 | DIVISIONAL PROCESSING COMPLETE |
2004-04-20 | EXTENSION 2 FILED |
2004-05-04 | EXTENSION 2 GRANTED |
2004-08-11 | CASE FILE IN TICRS |
2004-10-20 | TEAS EXTENSION RECEIVED |
2004-10-20 | EXTENSION 3 FILED |
2004-10-29 | EXTENSION 3 GRANTED |
2005-02-28 | TEAS EXTENSION RECEIVED |
2005-02-28 | EXTENSION 4 FILED |
2005-03-18 | EXTENSION 4 GRANTED |
2005-09-08 | TEAS EXTENSION RECEIVED |
2005-09-08 | EXTENSION 5 FILED |
2005-09-08 | EXTENSION 5 GRANTED |
2006-06-27 | ABANDONMENT - NO USE STATEMENT FILED |
2006-06-27 | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED |