epoxy compounds used in the maufacture of electrical components; thermosetting resins for tooling and structural applications and for use as adhesives in the packaging industry; wood filler; namely, moldable synthetic clay-like material setting to a solid which can be worked like wood; chemical preparations used in the manufacture of metal foil; adhesives for aerospace, household and general industrial applications; conductive cements and adhesive coatings used in the manufacture of electrical components; resin-based adhesive compositions for general industrial manufacturing use; semiconductor molding powder; splice closure compounds; plastisols and elastomers used in the manufacture of industrial printing inks, automotive air and oil filters, dip coatings for metal parts, coatings for fabrics, sound deadening, and laminating; molding and extrusion plastics in powdered form for use in automotive and general industrial applications; release agents, mold release compounds, and chemical compositions to promote the adhesion of mold release agents, all for general industrial use; papermaking pulp made from hemp fibers; chemicals for industrial waste water treatment, plastisol compounds for use in the manufacture of food and beverage containers