Image Trademark with Serial Number 79085813
Status: 739 - Section 71 & 15-Accepted And Acknowledged
Image for trademark with serial number 79085813
Serial Number
79085813
Registration Number
4069118
Word Mark
Status
739 - Section 71 & 15-Accepted And Acknowledged
Status Date
2018-03-13
Filing Date
2010-05-13
Registration Number
4069118
Registration Date
2011-12-13
Mark Drawing
2000 - Illustration: Drawing or design without any word(s)/letter(s)/ number(s) Typeset
Design Searches
260715, 260721 - Four or more diamonds. Diamonds that are completely or partially shaded.
Published for Opposition Date
2011-09-27
Attorney Name
Law Office Assigned Location Code
M40
Employee Name
SALEM-HOWEY, AISHA YAS
Statements
Certificate of Correction for Registration
In the statement, Page 1, line 36 through page 2, line 1 through 3 "plasma processing machines, plasma cleaning machines, namely, plasma reforming machines, plasma sterilization machines, plasma surface treatment machines, namely, and plasma modification machines" should be deleted, and "apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for removing oxide film using plasma and used in processing semiconductor substrate and metal, and in a manufacturing process of semiconductor devices, electronic component, and metallic automobile component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; apparatus for hardening metal surface using plasma for improving abrasion resistance of cutting tool; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof" should be inserted.
Indication of Colors claimed
Color is not claimed as a feature of the mark.
Description of Mark
The mark consists of a diamond design composed of nine smaller shaded diamonds.
Goods and Services
Machines used in assembly lines, namely, placers, mounters and inserters of electronic components for manufacturing and assembling printed circuit boards; electronic component inserters for machines used in manufacturing and assembling printed circuit boards; industrial printing machines, namely, screen printers for manufacturing and assembling printed circuit boards; power-operated viscous fluid dispensers for machines used in manufacturing and assembling printed circuit boards; [ machines for manufacturing and assembling printed circuit boards, namely, adhesive curing machines for assembling printed circuit boards; autogenous soldering machines used for manufacturing and assembling printed circuit boards; machines for manufacturing and assembling printed circuit boards, namely, feeders of printed circuit boards; parts of machines exclusively used for provisional storing of printed circuit boards in the process of manufacturing and assembling thereof; conveyors used for printed circuit boards * for semiconductor manufacturing machines and systems *; machines for manufacturing and assembling printed circuit boards, namely, machines that reverse the orientation of circuit boards; machines for manufacturing and assembling printed circuit boards, namely, machines that rotate circuit boards; power-operated tools, namely, buffers for printed circuit boards * for semiconductor manufacturing machines and systems *; loading and unloading machines for manufacturing and assembling printed circuit boards * for semiconductor manufacturing machines and systems *; machine parts, namely, adhesive tape cartridges that dispense tape for electronic component placers, mounters and inserters used to manufacture and assemble printed circuit boards * for semiconductor manufacturing machines and systems *; ] machines for manufacturing and assembling printed circuit boards, namely, electronic component feeders * for semiconductor manufacturing machines and systems *; machines for manufacturing semiconductors; metalworking machines and tools; power-operated metalworking machine tools, namely, turning tools; lathes for metalworking; machining centres; [ automatic assembling machines for assembling printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries, namely, plasma processing machines, plasma cleaning machines, plasma reforming machines, plasma sterilization machines, plasma surface treatment machines, and plasma modification machines * apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for removing oxide film using plasma and used in processing semiconductor substrate and metal, and in a manufacturing process of semiconductor devices, electronic component, and metallic automobile component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; apparatus for hardening metal surface using plasma for improving abrasion resistance of cutting tool; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof *; ] automatic assembling machines for assembling circuit boards, LED circuit boards, electronic circuits, telecommunication * machines * [ devices and apparatus ], photographic * machines * [ instruments and apparatus ], cinematographic * machines * [ instruments and apparatus, lighting apparatus, LED light machines ], power distribution or control machines [ and apparatus, batteries ] and * fuel cells, solar cells and secondary * cells, AC motors and DC motors, metalworking machines, medical machines and game machines
Classification Information
International Class
007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements (other than hand-operated); incubators for eggs. - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements (other than hand-operated); incubators for eggs.
US Class Codes
013, 019, 021, 023, 031, 034, 035
Class Status Code
6 - Active
Class Status Date
2010-09-03
Primary Code
007
Current Trademark Owners
Party Type
30 - Original Registrant
Address
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Trademark Owner History
Party Type
30 - Original Registrant
Address
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Party Type
20 - Owner at Publication
Address
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Party Type
10 - Original Applicant
Address
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Correspondences
Name
Jeffrey H. Kaufman
Address
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International Registrations
International Registration Number
1047019
International Registration Date
2010-05-13
International Publication Date
2010-09-09
International Renewal Date
2030-05-13
Auto Protection Date
2012-03-02
International Status
001 - Request for extension of protection established
International Status Date
2010-09-02
Priority Claimed In
True
Priority Claimed Date
2009-11-17
First Refusal In
True
Trademark Events
Event DateEvent Description
2010-09-02SN ASSIGNED FOR SECT 66A APPL FROM IB
2010-09-03NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
2010-09-03ASSIGNED TO EXAMINER
2010-09-07APPLICATION FILING RECEIPT MAILED
2010-09-11NON-FINAL ACTION WRITTEN
2010-09-12NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
2010-09-13REFUSAL PROCESSED BY MPU
2010-09-13NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
2010-10-03REFUSAL PROCESSED BY IB
2011-03-11TEAS RESPONSE TO OFFICE ACTION RECEIVED
2011-03-11CORRESPONDENCE RECEIVED IN LAW OFFICE
2011-03-11TEAS/EMAIL CORRESPONDENCE ENTERED
2011-03-11TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
2011-03-11ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
2011-04-05FINAL REFUSAL WRITTEN
2011-04-05FINAL REFUSAL E-MAILED
2011-04-05NOTIFICATION OF FINAL REFUSAL EMAILED
2011-06-20TEAS REQUEST FOR RECONSIDERATION RECEIVED
2011-06-30ASSIGNED TO LIE
2011-07-15CORRESPONDENCE RECEIVED IN LAW OFFICE
2011-07-15TEAS/EMAIL CORRESPONDENCE ENTERED
2011-08-16APPROVED FOR PUB - PRINCIPAL REGISTER
2011-08-22LAW OFFICE PUBLICATION REVIEW COMPLETED
2011-09-07NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB
2011-09-07NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
2011-09-27PUBLISHED FOR OPPOSITION
2011-09-27OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
2011-12-13REGISTERED-PRINCIPAL REGISTER
2012-03-13FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
2012-03-19FINAL DISPOSITION PROCESSED
2012-03-19FINAL DISPOSITION NOTICE SENT TO IB
2012-04-13FINAL DECISION TRANSACTION PROCESSED BY IB
2012-05-25NOTIFICATION PROCESSED BY IB
2013-02-04LIMITATION OF GOODS RECEIVED FROM IB
2013-05-08ASSIGNED TO PARALEGAL
2013-05-08CORRECTION UNDER SECTION 7 ¿ PROCESSED
2013-05-08LIMITATION FROM THE IB EXAMINED AND ENTERED
2014-01-08PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
2014-06-26INVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE
2016-12-13COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED
2017-10-12TEAS SECTION 71 & 15 RECEIVED
2017-11-14CASE ASSIGNED TO POST REGISTRATION PARALEGAL
2018-03-13REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK.
2018-03-13NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED
2018-04-23CASE ASSIGNED TO POST REGISTRATION PARALEGAL
2018-05-01REVIEW OF CORRESPONDENCE COMPLETE - ADDRESS NOT UPDATED
2018-12-06CHANGE OF NAME/ADDRESS REC'D FROM IB
2020-06-04INTERNATIONAL REGISTRATION RENEWED
2020-12-13COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED
2021-08-30TEAS SECTION 71 RECEIVED