Sealing compounds for sealing electronic components and component groups; sealing compounds having electromagnetic shielding properties for sealing electronic components; electrically insulating, thermally conductive sealing compounds for use with electronic components and component groups; all of the afore-mentioned goods being semi finished products consisting of or comprising plastics filled or unfilled, in particular insulating polymers; ceramic tapes as sinterable semi-finished materials and carrier materials, namely thermal management material for insulating purposes for electronic industry; ceramic tapes, except for packaging purposes, as sinterable semi-finished materials for electrical insulation and heat dissipation; heat conducting films made of plastics with compressible and self-relaxing properties, namely for use in electrical circuits and with electronic circuit elements for the purpose of heat dissipation, heat spreading or as thermally conductive intermediate material with or within heat generating components; flexible thermally conductive material for electrical insulation for the microelectronic and semiconductor industry