[ PLASTICS ADDITIVES, IN PARTICULAR POLYMER BONDED NANOFIBER MASTER BATCHES AND COMPOUNDS FOR REINFORCEMENT IN COMPOSITE MATERIALS FOR MECHANICAL, ELECTRICAL AND THERMAL USE; THERMALLY CONDUCTING ADHESIVES ALSO IN THE FORM OF PASTES; THE FOREGOING ALL FOR USE IN MANUFACTURING IN THE AUTOMOTIVE, AEROSPACE, MEDICAL, AND ELECTRONICS INDUSTRY, FOR USE IN ENVIRONMENTAL TECHNOLOGY AND FOR USE IN MAJOR APPLIANCES ]

[ TEMPERATURE CONTROLLERS, TEMPERATURE CONTROLLERS WITH BIMETAL DISKS, TEMPERATURE CONTROLLERS WITH EXPANSION RODS, THERMAL CUT-OUTS WITH BIMETAL DISKS, THERMAL CUT-OUTS WITH EXPANSION RODS, ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; TEMPERATURE SENSORS, OXYGEN SENSORS, ELECTRONIC CONTROL AND EVALUATION UNITS FOR THE OPERATION AND SIGNAL EVALUATION OF OXYGEN SENSORS; OXYGEN MEASUREMENT APPARATUS, NAMELY, OXYGEN SENSORS; SENSORS FOR MONITORING LIQUID LEVEL, TEMPERATURE AND AIR FLOW; THERMAL SWITCHES, TEMPERATURE FUSES ALL THE FOREGOING FOR USE IN THE ELECTRONICS, AUTOMOTIVE, AEROSPACE AND SEMICONDUCTOR INDUSTRY; ] COMPONENTS IN THE NATURE OF HOUSINGS FORMED OF COMPOSITE MATERIALS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; COMPONENTS FORMED WITH GLASS BUSHINGS IN THE NATURE OF HOUSINGS FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE IN THE COMPUTER INDUSTRY; HYBRID HOUSINGS, NAMELY, HOUSINGS MADE OF METAL AND CERAMIC, FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR HOUSING TRANSISTORS, PASSIVE AND ACTIVE ELECTRONIC PARTS, OPTO-COUPLERS AND OPTO-ELECTRONIC PACKAGES; HIGH FREQUENCY HOUSINGS FOR OPTO-ELECTRONIC PACKAGES, AUTOMOTIVE ELECTRONICS AND ELECTRONIC FREQUENCY CONTROLS; HOUSINGS MADE OF METAL WITH GLASS BUSHINGS IN PARTICULAR FOR ELECTRONIC AND ELECTRICAL MODULE UNITS AND THEIR PARTS FOR USE WITH COMPUTERS, NAMELY, FOR TRANSISTORS, SENSORS, PASSIVE AND ACTIVE ELECTRONIC PARTS; HOUSINGS MADE OF METAL FOR OPTOELECTRONIC COMPONENTS, NAMELY, LCD AND CMOS CHIPS, LASERS AND OPTO-COUPLERS; [ COOLERS WITH LIQUID COOLING AGENT FOR ELECTRONIC AND ELECTRICAL MODULE UNITS, ELECTRONIC AND ELECTRICAL COMPONENTS, ELECTRONIC AND ELECTRICAL APPARATUS AND THEIR PARTS, IN PARTICULAR MICRO CHANNEL COOLERS, HIGH PERFORMANCE COOLERS, COOLERS FOR PC (PERSONAL COMPUTER) HOUSINGS; COOLERS FOR LASER DIODES; CONTROL UNITS FOR CERAMIC SURFACE COOK TOPS FOR COOKING APPLIANCES; ] TRANSISTOR HEADERS, NAMELY, HOUSINGS FOR SEMICONDUCTOR CHIPS INCLUDING CONNECTING LEADS, FINS OR BALLS; COVERS FOR ELECTRIC BATTERIES IN PARTICULAR MADE OF STEEL OR SPECIAL STEEL; SENSOR HOUSINGS; IGNITER HEADERS, NAMELY, AIRBAG PYROLYTIC CHARGE IGNITER HEADERS [; THERMALLY CONDUCTING INTERFACE MATERIALS IN THE FORM OF THERMOCOUPLES FOR THE THERMAL COUPLING OF ELECTRICAL AND ELECTRONIC COMPONENTS; FIELD EMISSION CATHODES, HEAT SINKS AND HEAT STRADDLERS, NAMELY, HEAT SINKS FOR USE IN POWER ELECTRONIC MODULES, HEAT SINKS FOR USE IN MICROPROCESSORS, HEAT SINKS FOR USE IN POWER CHIPS SUCH AS LIGHT EMITTING DIODES OR LASERS, ALL FOR USE IN THE ELECTRONICS FIELD; CIRCUIT BOARDS, IN PARTICULAR CERAMIC CIRCUIT BOARDS; SEMICONDUCTOR CHIP HOUSINGS MADE OF COPPER COATED CERAMIC, IN PARTICULAR MADE OF COPPER COATED ALUMINUM OXIDE CERAMIC OR ALUMINUM NITRIDE CERAMIC FOR USE IN THE ELECTRONICS FIELD; COPPER COATED ALUMINUM OXIDE SUBSTRATES FOR INTEGRATED CIRCUITS; COPPER COATED ALUMINUM NITRIDE SUBSTRATES FOR INTEGRATED CIRCUITS; THERMALLY CONDUCTING FOILS AND PADS FOR USE AS HEAT SINKS IN ELECTRONIC COMPONENTS IN THE NATURE OF INTEGRATED CIRCUITS ]

ELECTRICAL INSULATORS, NAMELY, GLASS BUSHINGS, IN PARTICULAR PRE-STRESSED GLASS BUSHINGS AND TUNED GLASS BUSHINGS FOR USE IN INTEGRATED CIRCUITS [: CARBON NANOFIBERS NOT FOR TEXTILE USE; GRAPHITIC NANOFIBERS NOT FOR TEXTILE USE; THERMALLY CONDUCTING ADHESIVE TAPES FOR INDUSTRIAL AND COMMERCIAL USE ]